Volt-Resistance Thermal Insulation Film TM-K4

Volt-Resistance Thermal Insulation Film TM-K4, Bergquist Sil-Pad K4 Replacement

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Volt-Resistance Thermal Insulation Film TM-K4

Volt-resistance thermal insulation material TM-K4 replace the insulating film plus the hot paste of the traditional chip installation, it can be clean, fast, high reliability application.

Volt-resistance thermal insulation material TM-K4 using thermal polyimide as a substrate, the surface is high thermal conductivity silicone coating, which can be used in extreme requirements of the insulation environment, due to it's high stability of polyimide and high compressive capacity, to it achieves a perfect balance of insulation and thermal conductivity.

It can replace the Bergquist Sil-Pad K4 series

**Volt-Resistance Thermal Insulation Film TM-K4 Datasheet**
Item	Unit	TM-K4	Method
Reinforced Carrier	-	Polyimid	Visual
Color	-	Gray	-
Thickness	mm	0.15	ASTM D374
Specific Gravity	g/cm3	1.5	ASTM D792
Hardness	Shore A	90	ASTM D2240
Thermal impedance	℃in2/W	0.53	ASTM D5470
Thermal Conductivity	W/mK	0.8	ASTM D5470
Volume Resistivity	Ωcm	>10¹³	ASTM D257
Breakdown Voltage	KV	6	ASTM D149
Dielectric Constant	1	5	ASTM D150
Application temperature	℃	-50~180	-
Tensile strength	psi	4000	ASTM D149
Elongation	%	40	ASTM D149
Flammability	UL94	V-0	UL94

**Similar Material Comparison**
Brand	Baisontech	Bergquist
Model	TM-K4	Sil-Pad K4
Conductivity(W/m-k)	0.8	0.9
Thickness(mm)	0.15	0.15
Breakdown Voltage(KV/mm)	6	6
Hardness(Shore A)	90	90
Compliance	UL94	UL94